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Deep into the factory | How are high-precision multi-layer boards intelligently manufactured?

Published on:

2023-05-12 15:36

Before entering the factory, let's first popularize the multilayer board process:

Cutting board → inner layer→ AOI → pressing→ drilling→ immersion copper/electroplating→ outer dry film → etching→AOI → soldering mask→ text→ surface treatment→ electrical measurement → molding→ V cutting →FQC→FQA;

Starting from the cutting of the board, it is cut to the working size adapted to the production equipment in the factory according to the engineering design specifications.

1. Inner process

In order to attach a layer of photosensitive dry film, laser imaging, development, etching and other steps are required to form a circuit pattern.

2. Pressing

The purpose of pressing: the inner core board of the stacked semi-cured PP sheet (composed of resin and glass fiber) is fixed together by the fusion of the hot melt machine to ensure the alignment of the graphics of different layers to avoid interlayer slippage during subsequent processing, and multiple inner core boards are pasted together by high temperature and high pressure to form a multi-layer board.

The operation of the machines in the workshop is computer-controlled

3. Drilling

Generally, according to customer needs, conduction holes, plug-in holes, VIA holes, and screw holes are drilled for the line connection between layers.

Equipment operation in the drilling shop

4. PTH/electroplating

Copper immersion and electroplating are to attach conductivity to the hole wall and ensure the reliability of the PCB interconnection, so as to complete the electrical interconnection. Simply put, it is to metallize the hole.

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